![New Material Developed for Thermal Insulation]( "New Material Developed for Thermal Insulation")
LANZHOU, Feb. 27 (Xinhua) -- Researchers have developed a new type of ceramic aerogel which can be used in thermal insulation.The new ceramic aerogel, developed by Chinese and American researchers, has strong mechanical and thermal stability, as well as excellent performance in transformation and toughness.Aerogels, made of ceramics, carbon, or metal oxide, have a robust structure, said Zhang Qiangqiang, a professor at Lanzhou University in northwest China's Gansu Province.Previous ceramic aerogels were plagued by poor mechanical stability and degradation under thermal shock. The new material is considered an ideal thermal insulation material due to its low density, low thermal conductivity, and fire resistance.The new aerogel maintained great mechanical stability throughout hundreds of severe thermal changes between minus 198 degrees Celsius and 900 degrees Celsius. It had less than one percent degradation under thermal shock.Lightweight aerogels are promising replacements for thermal...
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The new ceramic aerogel, developed by Chinese and American researchers, has strong mechanical and thermal stability, as well as excellent performance in transformation and toughness.
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The application fields of powder metallurgy technology are expanding day by day. In order to further promote the technological innovation of new materials, new technologies and new process in powder metallurgy industry
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Register before March 15th will get a chance to participate for FREE!
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2019 China Summit Forum on Cutting-edge Technology Application and Development in Advanced Ceramic Industry & Academic Annual Meeting of the Industrial Ceramics Committee of Chinese Ceramic Society will ceremoniously be held on March 24th, 2019 at Howard Johnson Peace Hotel Shanghai.
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UCLA researchers and collaborators at eight other research institutions have created an extremely light, very durable ceramic aerogel. The material could be used for applications like insulating spacecraft because it can withstand the intense heat and severe temperature changes that space missions endure.
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The electronics market is growing constantly and so is the demand for increasingly compact and efficient power electronic systems. The predominant electronic components based on silicon will in the foreseeable future no longer be able to meet the increasing industrial requirements. This is why scientists from the university of Freiburg, the Sustainability Center Freiburg and the Fraunhofer-Gesellschaft have joined forces in order to explore a new material structure that may be better suited for future power electronics.
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Riccardo Comin seeks to elucidate the microscopic physics of high-temperature superconducting devices to advance their technological applications, writes Denis Paiste
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Open-cell materials, such as metal and ceramic foams, have been extensively utilized in high-temperature applications due to their light weight, good flow-mixing capability, and ability to cover a large surface area. They are commonly composed of interconnected solid struts and accessible void spaces
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